Endoscope Module Manufacturing Process

1. Front-end Preparation

Wafer Processing: Thinning (50-100μm), dicing, improving heat dissipation and packaging density

Substrate Pretreatment: FPC/PCB cleaning, nickel-gold plating (2μm immersion gold + 6μm electroless nickel), enhancing corrosion resistance

Window Processing: Sapphire window Cr/Ni/Au multi-layer nano-coating, improving soldering adhesion

2. Core Assembly

Chip Mounting: ±5μm precision pick-and-place machine to fix sensors, conductive/insulating adhesive bonding

Bonding Process: High-precision wire bonding (solder joint diameter ≤0.25mm), signal delay ≤28ms Optical Assembly: Active alignment of lens and sensor (±1μm accuracy) → UV adhesive pre-curing + structural adhesive heat curing

LED Integration: Micro SMT placement (position deviation ≤±10μm), avoiding spot shift

3. Sealing and Encapsulation

Primary Sealing: Gold-tin brazing for medical endoscopes (sapphire window + metal shell); Vacuum brazing for industrial endoscopes (metal-ceramic sealing ring)

Secondary Encapsulation: Integrated potting with medical-grade liquid silicone (leak-free for 72 hours at 0.5MPa) or ultra-thin resin encapsulation (diameter <1mm)

Post-processing: Cutting and separating boards, surface treatment, label printing